Equipped with a large number of parametric modeling macros for specialized components of electronic devices, Simdroid-EC enables rapid and accurate modeling of various cooling scenarios.

• Basic Geometric Shapes: Cube, Plane, Cylinder, Prism, Pipe, Sloping Block, and other basic geometry models.
• Common Functional Components: Provides parametric models of common components in electronic devices, such as PCB, Component, Heatsink, Fan, TEC, Die, etc. These models can be physically simplified based on the fluid flow and heat transfer characteristics of the devices.
• Physical Condition Settings: Supports adding physical properties directly to geometric models, including flow and thermal boundaries, to achieve fluid flow heat transfer analysis in complex equipment.
• Rapid Model Import: Supports direct import of complex geometric models (STEP format) from CAD software with automated voxelization processing. It is also compatible with industry-standard thermal simulation files (ECXML) and ECAD-generated PCB layout files (IDF, ODB++, GDS formats), as well as thermal profile configuration data.
• Convenient Preprocessing Operations: Provides different types of geometric drawing styles and rendering modes, convenient hiding and showing functions for parts, geometric sectional view display, flexible mouse operations and shortcut keys. Supports alignment of surfaces, volumes and points, conversion of devices based on points, lines and surfaces, as well as operations such as copying, moving, mirroring, measuring, and rotating.

Simdroid-EC enables cross-scale orthogonal hexahedral meshing, delivering fast and stable meshing for tens of thousands of user-created or imported models. It supports meshing and visualization of up to hundreds of millions of elements, ensuring precision across complex geometries and scales.

• Local Mesh Control: Supports local mesh refinement and boundary layer mesh settings to optimize both computational efficiency and accuracy.
• Automatic Meshing: Automatically handles the overlaps between models, recognizes fluid flow and heat transfer boundaries, and significantly reduces preprocessing time.
• Mesh Quality Check: Enables viewing mesh distribution on any cross-section and calculates mesh quality metrics such as skewness and aspect ratio.
• Multiple Meshing Modes: Supports region-based meshing with mesh projection capabilities and octree-based meshing modes.
  1. Mesh Projection of Region-Based Meshing Mode：Based on region-based meshing algorithm, enables rapid generation of mesh projections in X/Y/Z directions, enhancing the efficiency of mesh quality optimization.
  2. Region-Based Meshing Mode：Performs comprehensive and detailed meshing of the entire model. Enables users to check mesh quality of individual components, with separate visualization of fluid and solid mesh quality after loading it.
  3. Octree-Based Meshing Mode：Starts with a 3D space as the root node, recursively subdividing it into eight smaller cubes to form a tree structure. This algorithm enables precise discretization of complex irregular geometries with fewer mesh elements, enhancing mesh generation efficiency.
• Cutcell Mesh：Adapts to geometric boundaries by cutting mesh cells, eliminating manual mesh adjustment. Automatically handles complex geometries with minimal dependence on the underlying model, ensuring precise conformity to irregular shapes.

Simdroid-EC employs the finite volume method (FVM) to conduct fluid-thermal coupling simulations, delivering a high-precision discretization approach for computational fluid dynamics (CFD). Additionally, it incorporates industry-specific expertise in electronic cooling, enabling the generation of highly accurate CFD simulation results. The convergence of calculation is also excellent.

• Fluid Simulation: Provides segregated and coupled pressure-velocity coupling methods. It solves laminar and turbulence flow model and analyzes the fluid flow & heat transfer of steady and transient scenario.
• Scenario Analysis: Supports thermal conduction, natural convection cooling, forced air cooling, liquid cooling, thermal radiation, solar radiation, and thermoelectric cooling, etc.
• Reduced Order Calculation: Generates the BCI-ROM model (a reduced order model independent of boundary conditions) for complicated heat conduction problems, assisting in rapid thermal analysis within system simulations. It can extracte an accurate reduced-order thermal model for chip packaging. The accuracy of this model is comparable to that of the detailed model, but it does not reveal the detailed internal structure of the chip, thus providing good confidentiality.
• Parallel Computing: Supports parallel computing with more than 100 cores to quickly solve CFD models with a large number of mesh cells.
• GPU-Accelerated Computing: Adaptively allocates the GPU to achieve dynamic load balancing, efficiently utilizes the video memory. The speedup ratio has exceeded 20 times.

According to the heat cooling characteristics of electronic equipment, Simdroid-EC provides a statistical analysis function of CFD simulation to help users make a quick judgment of the CFD results.

• Dynamic Rendering: Supports contour plots, vector plots, streamline plots, animation, and other visualization functions.
• Automatic Statistics: Automatically calculates average temperature, heat flow, mass flow, volume flow for CFD model, and many other thermal transfer data. The results can help engineers quickly locate heat transfer bottlenecks of the model.
• Result Comparison: Shows the difference of simulation results in different cases and provides convenient guidance for model structure optimization.